Earlier this year ARM designed a dual-core test chip implementation of the Cortex-A9 processor targeting Samsung’s 32nm LP process using the Cortex-A9 Processor Optimization Pack, to evaluate the POP’s capabilities. The resulting test chip was manufactured by Samsung; the silicon is functional and now being tested by ARM where operation at up to 1.6GHz under nominal conditions has been observed.
“Mobile SoC designs are requiring not only low-power but higher performance for the increasing range of applications now available to mobile users,” said Jay Min, vice president business development for Samsung Foundry and ASIC. “We are pleased to see the powerful combination of Samsung’s 32nm LP HKMG process with ARM cores and physical IP to provide the highest levels of energy efficiency and performance in next generation SoC platforms.”
“ARM has pushed the envelope to deliver a unique enhanced physical IP product that highlights the compelling advantages of Samsung 32nm HKMG technology”, says John Heinlein, vice president of marketing, ARM Physical IP Division. “Through this package, which features ARM Artisan physical IP to accelerate critical paths in the design, we are delivering a platform that enables the most advanced mobile chips in the industry”