Architecting the Future IP platforms with supply chains

At the beginning of a new custom chip development, the most important question is who to partner with to reduce risk and time to market (TTM). Being first to market with a new, innovative chip could be worth millions if it establishes a market-leading position.

Such a consideration of TTM also reduces the risk by being off-the-shelf. Sondrel’s supply chain manufacturing service has further reduced risk and TTM as it has created a series of pre-packaged supply chains specifically tailored for each of its Architecting the Future platforms.

As Ian Walsh, Sondrel’s VP ASIC Business Development explained: “A new chip is a major decision for any company and it is thus vital to mitigate risks. We reduce risks with our pre-packaged SFA designs and now reduce risks further with our pre-packaged supply chain routes for each. Unknowns are virtually removed giving a clearly defined and well-trodden path from design to shipping silicon making us the partner of choice to deliver on time and on budget.”

Further details on Sondrel’s range of Architecting the Future ASIC IP platforms can be found at Sondrel's page here.

About Sondrel

Founded in 2002, Sondrel is the trusted partner of choice for handling every stage of an integrated circuit's creation. Its award-winning, define and design ASIC consulting capability is fully complemented by its turnkey services to transform designs into tested, volume-packaged silicon chips. This single point of contact for the entire supply chain process ensures low risk and faster times to market. Headquartered in the UK, Sondrel supports customers around the world via its offices in China, India, Morocco and North America.