Phison Electronics is collaborating with Supermicro to showcase one of the most advanced server solutions, to address growing demand for support for high-density workloads.
Through this partnership, customers using Supermicro’s Petascale storage family will be able to leverage Phison’s high-capacity 122.88TB Pascari D250V SSD, featuring a unique E3.L form factor and Gen5 NVMe performance.
The result is a purpose-built solution delivering high-performance storage density, thermal efficiency, and scalability in enterprise infrastructure.
As enterprises tackle infrastructure shifts to support data-intensive workloads such as AI and machine learning training, real-time analytics and Cloud-scale storage, striking a balance between high-performance and scalable capacity is more essential than ever.
As part of this collaboration, Phison will deliver storage solutions to support Supermicro’s Petascale Storage with unmatched capacity per slot, allowing users to reduce total rack space, lower operational costs and simplify infrastructure planning at scale, whether at the Edge or in the data centre.
The E3.L form factor belongs to the broader EDSFF family offered in the Pascari D-Series and is specifically engineered for high-density, high-performance environments and designed to be hot-pluggable and front-accessible. Compared with legacy U.2 and U.3 designs, E3.L offers a longer form factor which unlocks double the capacity compared to E3.S as well as improved airflow and thermal management, making it well suited for AI training clusters, hyperscale environments, and dense Edge deployments where cooling and space are critical constraints.
“This innovative collaboration with Supermicro sets a precedent to keep pace with the increasing storage demands of tomorrow,” said Michael Wu, GM and President, Phison US. “Customers can expect their storage solutions to have built-in scalability and cost optimizing features from the drive to the rack architecture.”
