This new capacity and form factor complements the previously announced 122.88TB 2.5-inch model and is specifically engineered for the performance and efficiency demands of generative AI (GenAI) environments.
GenAI places unique demands on storage, including the need to store vast datasets for training large language models (LLMs), and to create embeddings and vector databases that support inference through retrieval augmented generation (RAG). These workloads demand storage solutions with large capacity, high speed, and exceptional power efficiency.
Featuring a 32-die stack of 2Tb BiCS FLASH QLC 3D flash memory with innovative CBA (CMOS directly Bonded to Array) technology, KIOXIA LC9 Series SSDs provide the speed, scale, and density required to support the next wave of AI-centric workloads. This combination of advanced memory architecture and CBA technology enables 8TB in a small 154 BGA package. This achievement was made possible with advancements in KIOXIA’s high-precision wafer processing, material design, and wire bonding technologies.
KIOXIA LC9 Series SSDs are well-suited for data lakes, where massive data ingestion and rapid processing are essential. Unlike HDDs, which often bottleneck performance and leave costly GPUs underutilised, KIOXIA LC9 Series SSDs enable dense storage in a compact footprint. By delivering up to 245.76TB, each drive can replace multiple power-hungry HDDs, offering superior performance, lower overall power consumption, fewer drive slots used, and more efficient cooling, which would significantly lower total cost of ownership.
“We continue to drive innovation with the new KIOXIA LC9 Series, providing cutting-edge technology that enables our data centre and hyperscaler customers to stay ahead,” said Paul Rowan, VP & CMO, KIOXIA Europe. “The 32-die stack of 2Tb BiCS FLASH QLC 3D flash memory coupled with our innovative CBA technology and the E3.L form factor within the LC9 Series SSDs address their unique requirements of Generative AI applications for speed, scale and efficiency.”
