The RadStop technology combines manufacturing process hardening and proprietary design techniques. The new devices with RadStop technology deliver single event latch-up and single event functional interrupt immunity at temperatures as high as 125 degrees Centigrade.
Cypress offers four configurations of the 72 Megabit QDR II with RadStop technology. They are available in both x18 and x36 bus widths, and with two- and four-word burst modes. All the devices are offered in 165-pin Ceramic Column Grid Array (CCGA) packages. The devices are manufactured in the Cypress FAB-4 facility, a Microelectronics Trusted Category 1A Fabrication facility, located in Bloomington, Minnesota, and are exclusively packaged and tested in the United States.
“The 72 megabit QDRII with Radstop technology is a game changing memory for radiation hardened applications. The size, weight, and power consumption benefits enable designers to maximize performance while significantly reducing board space,” said Walt Anderson, Senior Director of Cypress’s Aerospace and Defense Business Unit.