The small form factor module with dimensions as small as 67.6 x 30.0mm offers two ranks and is built with sixteen 256Mx8 DRAMs. It contains Winbond 2GB DRAM components based on the advanced “buried wordline” process. This low power technology with very small internal parasitic capacitors and high data retention makes the device ideal for industrial small form factor PCs with high memory demand and for applications within industrial temperature range.
Intensive testing during burn-in at low and high temperatures guarantees for a high quality product. The module is available in both commercial 0°C to +85°C (TCase) and industrial -40°C to +95°C (TCase) temperature grades at PC2-5300 speed grade.
The 4GB module is compatible to the JEDEC DDR2 SODIMM specification and is supported by most of the recent DDR2 memory controllers like the Mobile Intel® 4 Series Express chipset Family (GM45, GS45, Q45).