Anna Wood, Editor at Electronic Specifier, picks her top 5 IoT products released in February 2026.
NB-IoT industrial modules deliver extended LTW coverage
Authorised distributor Mouser Electronics is now shipping the ST87M01 ultra-compact, low-power narrowband (NB-IoT) industrial modules from STMicroelectronics.
This high-performance, fully programmable industrial module series covers worldwide cellular frequency bands and offers advanced security features.
They are the ideal choice for Internet of Things (IoT) applications that require Low Power Wide Area Network (LPWAN) connectivity, including smart grids, smart buildings, smart infrastructure, and industrial monitoring and factory automation.
Infineon introduces the industry’s first Wi-Fi 7 IoT 20MHz tri-radio
To support continued growth of connected devices in home, industrial and commercial markets, Infineon Technologies AG introduced the AIROC ACW741x, a new product family that integrates a tri-radio with Wi-Fi 7, Bluetooth LE 6.0 with Channel Sounding, and IEEE 802.15.4 Thread, with Matter ecosystem support in a single device.
This product family introduces the industry’s first 20MHz Wi-Fi 7 device for IoT, provides Wi-Fi 7 Multi-Link for IoT for enhanced robustness in congested environments and has the industry’s lowest Wi-Fi connected standby power.
With Wi‑Fi 7 Multi‑Link for IoT, the ACW741x boosts link reliability with Adaptive Band Switching to mitigate congestion and interference. By maintaining concurrent links across 2.4, 5, and 6GHz, Wi‑Fi 7 Multi‑Link for IoT delivers a more consistent, always‑connected experience for applications such as security cameras, video doorbells, alarm systems, medical devices, and HVAC systems.
Nordic Semiconductor simplifies Edge AI for billions of IoT devices
Nordic Semiconductor is bringing AI intelligence and functionality to the smallest battery-powered IoT devices. With an, ultra-low-power Edge AI solution, Nordic accelerates the arrival of a new generation of devices with integrated Edge AI intelligence – combining energy efficiency with ease of use for developers.
- nRF54LM20B – New ultra-low-power, large-memory wireless SoC with Axon NPU
- Custom Neuton models – ultra-tiny Edge AI models
- Nordic Edge AI Lab – Development tool, simplifying and accelerating Edge AI development
“AI factories train intelligence, but Nordic deploys it – on device, at the Edge, where the world happens – said Vegard Wollan, CEO at Nordic Semiconductor.
Rutronik expands its Edge AI offering
With the cExpress-R8, Rutronik introduces a high-performance COM Express R3.1 Type 6 module from ADLINK, designed for AI-driven Edge computing. Powered by the AMD Ryzen Embedded 8000 Series, it delivers up to 40 TOPS AI inference performance. Combining high compute power, AI acceleration, extensive I/O connectivity and a compact form factor, the cExpress-R8 is ideal for industrial automation, medical imaging, transportation and surveillance platforms, as well as Edge-oriented video and analytics solutions. ADLINK also guarantees a 10-year product lifecycle – critical for long-term system designs.
cExpress-R8 from ADLINK is a COM Express R3.1 Type 6 Compact module (95x95mm) designed for demanding Edge AI applications. It is powered by AMD Ryzen Embedded 8000 Series processors with up to eight Zen 4 CPU cores, integrated RDNA 3 GPU architecture and an XDNA NPU for AI acceleration – offering up to 40 TOPS combined CPU, GPU, and NPU performance.
New power module enhances AI data centre power
The increasing AI and high-performance computing workloads demand power solutions that combine efficiency, reliability, and scalability. Integrated power modules help streamline design, reduce energy use, and deliver the stable performance required for advanced data centres.
Microchip Technology announces the launch of the MCPF1525 Power Module, a highly integrated device with a 16V Vin buck converter that can deliver 25A per module, stackable up to 200A. The MCPF1525 enables higher power delivery within the same rack space and is combined with a programmable PMBus and I2C controls. This device is designed to power the latest generation of PCIe switches and high-performance compute MPU applications needed for AI deployments.
The MCPF1525 is packaged in an innovative vertical construction that maximises board space efficiency and can offer up to a 40% board area reduction when compared to other solutions. The compact power module is approximately 6.8 x 7.65 x 3.82mm, making it an optimal solution for space-constrained AI servers.
