Controller solution aids FPGA power design
Designed to be used in conjunction with the FFED-VC1902-VSVA2197 power test adapter (PTA) and the X-Pod adapter, it provides a fast and comprehensive method for testing and validating power delivery solutions for AMD/Xilinx system-on-chips (SoCs) and field programmable gate arrays (FPGAs).
Designers can now measure regulator performance under actual operating conditions to verify power delivery performance. The power test adapter is a form factor equivalent device (FFED) that functions as the device under test (DUT).
This configuration allows corner testing of voltage regulation, complete thermal emulation, large signal time and frequency domain evaluation.
Developers can stress test the power delivery circuitry before fitting their SoC or FPGA.
Also available from Mouser are the Xilinx Power Test adapter kits.
Each adapter kit includes a set of three FFED test boards with a ball-grid array (BGA) footprint that reflows onto the PCB pads of the board.
Connectors are provided to connect the Power Test adapter to either the Pro Mini 200 LSP or the Pro LSP1000 Remote Sense kit.
The Remote Sense kit connects to a PC running graphic user interface (GUI) test software. The Power Test adapters are designed for AMD/Xilinx Versal AI Core Series and Versal Premium AIE devices.
The LoadSlammer LSP-Kit-OracADJ-X controller, FFED power test adapters, and Remote Sense kits are all designed to reduce the time to market and expenses associated with FPGA power supply design.
LoadSlammer also offers downloadable test plans, measurement techniques, and test vectors for test engineers.
Customisation of the tool suite is fast and optimised for use with the Power Design Manager software.
The Loadslammer LSP-Kit-OracADJ-X controller is available from Moser in the EMEA, Americas and Asia/Pacific regions.