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Too cool to drift: how thermal engineering is redefining system stability EnclosuresSponsored 24 August 2026
The new RE2 embedded computer: High performance, very low power demand and a minimal footprint Design 14 March 2011 byNews Desk
Whitepaper – FleXO(TM): Bridging the Cost/Performance Gap in the Oscillator Market Design 10 March 2011 byNews Desk
Mentor Graphics Introduces Calibre RealTime for Instant Signoff Verification of Custom IC Designs Design 10 March 2011 byNews Desk
Mentor Graphics Helps CamSemi Replace Design and Verification Flow to Improve Simulation Performance and Time to Market Design 9 March 2011 byNews Desk
Tekdata adds dynamic 3D modelling to interconnect design capabilities Design 9 March 2011 byNews Desk
GOEPEL electronic extends BSDL Testbench to Multi Chip Modules and 3D Chips Design 9 March 2011 byNews Desk
OKI Unveils Platform for Developing Business Applications for Android Devices Design 8 March 2011 byNews Desk
Mentor Graphics Announces Logic and Physical Synthesis Support for Xilinx 7 Series FPGAs Design 8 March 2011 byNews Desk
Synopsys Announces FPGA Synthesis Support for Xilinx’s Newest ISE Design Suite 13 Design 8 March 2011 byNews Desk
Model-based visual programming tool speeds application development on TI’s F2806x Piccolo™ floating-point microcontrollers Design 8 March 2011 byNews Desk
Green Hills Software announces second EAL6+/SKPP, high robustness certification by NSA for INTEGRITY-178B operating system Design 8 March 2011 byNews Desk
Avago Technologies and Xilinx Streamline Design of 10 Gigabit Ethernet Systems Using FPGAs and Optical Interconnects Design 8 March 2011 byNews Desk
Premium German Automaker Implements Dassault Systèmes’ V6 PLM Solutions as New Platform for Embedded Systems Architecture, Integration and Design Design 8 March 2011 byNews Desk
AMD Furthers Commitment to Embedded Customers with New Products and Expanded Support for Sales, Design and Software Design 7 March 2011 byNews Desk