Indium introduces new low-voiding Pb-free solder paste

It features exceptional low-voiding performance while providing excellent stencil print transfer efficiency and response-to-pause performance.

The flux is also fully compatible with the standard SnAgCu alloy systems favored by the electronics industry to replace conventional Pb-bearing solders.

Among its key features, Indium8.9HFRV offers:

• Low voiding when used with high-reliability alloys
• High transfer efficiency through small apertures (less than or equal to 0.66AR)
• Excellent wetting
• Superior response-to-pause performance
• Compatibility with both Air and N2 reflow environments