Indium introduces new low-voiding Pb-free solder paste

11th May 2023
Sheryl Miles

Indium Corporation is proud to introduce Indium8.9HFRV, a flux vehicle developed from the Indium8.9HF chemistry.

It features exceptional low-voiding performance while providing excellent stencil print transfer efficiency and response-to-pause performance.

The flux is also fully compatible with the standard SnAgCu alloy systems favored by the electronics industry to replace conventional Pb-bearing solders.

Among its key features, Indium8.9HFRV offers:

  • Low voiding when used with high-reliability alloys
  • High transfer efficiency through small apertures (less than or equal to 0.66AR)
  • Excellent wetting
  • Superior response-to-pause performance
  • Compatibility with both Air and N2 reflow environments


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