It features exceptional low-voiding performance while providing excellent stencil print transfer efficiency and response-to-pause performance.
The flux is also fully compatible with the standard SnAgCu alloy systems favored by the electronics industry to replace conventional Pb-bearing solders.
Among its key features, Indium8.9HFRV offers:
- Low voiding when used with high-reliability alloys
- High transfer efficiency through small apertures (less than or equal to 0.66AR)
- Excellent wetting
- Superior response-to-pause performance
- Compatibility with both Air and N2 reflow environments