Design
AGR launches software to give certainty on time, cost, and risk
AGR, has launched new software that gives drilling professionals an unrivalled understanding of time, cost, and risk when planning wells.
Arrow takes NVIDIA DRIVE AGX Orin developer kit worldwide
Arrow Electronics is collaborating with NVIDIA to distribute the DRIVE AGX Orin Developer Kit globally.
Development kit gives AI designers the edge
Avnet has produced the RASynBoard development kit to help hardware and software design engineers and embedded AI developers quickly adopt edge AI capabilities into their products.
Envision leverages MEMS sensor technology by Analog Devices for wind turbines
Analog Devices has announced that Envision Energy is adopting ADI's MEMS sensor technology in the company’s new generation of smart wind turbines.
Invibio launches implantable PEEK filament for 3D printing
Invibio Biomaterial, part of Victrex, a pioneer in the development of PEEK biomaterial solutions, has announced the launch of PEEK-OPTIMA AM Filament, an implantable PEEK polymer that is optimised for additive manufacturing.
Integrated development kit speeds design of FPGA-based satellite systems
Developers using FPGAs to meet satellite system payload and throughput requirements can speed designs by prototyping with space-qualified devices rather than commercial off-the-shelf silicon.
Silanna Semiconductor expands multi-port fast charger reference design portfolio
Silanna Semiconductor has unveiled the latest addition to its family of AnyPort fully integrated reference designs that provide everything an engineer needs to prototype and test fully functional multi-port fast charger applications rapidly.
Bostik launches new Born2Bond engineering adhesives
Bostik’s Born2Bond HMPUR and UV-CIPG engineering adhesive ranges have been extended to serve the needs of automotive electronics designers and manufacturers looking to protect automotive components from heat, liquids, humidity, chemicals and vibrations.
Listen introduces a new portable dual-channel audio interface
AudioConnect 2, Listen’s new compact and high resolution two-channel audio interface is designed for measurements anywhere from the production line to out in the field and is particularly suitable for headphone testing and in-car measurements.
SEGGER J-Link and Flasher fully support Nations Technologies’ N32 series MCU
SEGGER announces that its J-Link debug probe, and its Flasher family of professional in-circuit programmers, now fully support the N32 series MCUs from Nations Technologies.