Component Management

Two component epoxy meets medical device specifications

23rd September 2014
Nat Bowers
0

Suited for bonding, sealing, coating and encapsulation applications in the medical device industry, Master Bond's EP21AOLV-2Med is a two component epoxy system. The thermally conductive and electrically isolating epoxy withstands a variety of sterilisation methods, including EtO, radiation and many cold sterilants.

Bonding well to metals, composites, glass, ceramics, plastics and many rubber materials, the EP21AOLV-2Med offers a high tensile modulus of 450,000-500,000psi and a compressive strength greater than 18,000psi. The epoxy's viscosity and low coefficient of thermal expansion (very low shrinkage upon curing) make it suited for potting and encapsulation applications.

Serviceable over a temperature range from -51.1 to 121.1°C (-60 to +250°F), the medical grade epoxy system meets USP Class VI and ISO 10993-5 specifications and has biocompatibility and cytotoxicity certifications. It resists many chemicals, including water, oils and fuels.

Curing at room temperature or more rapidly with heat, the EP21AOLV-2Med features a one to one mix ratio by weight and has a working life of 4-6 hours at room temperature (100g batch). Easily applied with a spatula, knife, trowel, brush or paint roller, part A is grey and part B is off-white to simplify mixing.

With a shelf life of 6 months in its original, unopened containers, EP21AOLV-2Med is available in half pint kits, pint kits, quart kits, gallon kits and five gallon kits.

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