Its solid titanium solder pot and pump assembly, with a 12kg capacity for either lead-free or eutectic solder, is mounted to a heavy-duty, ball screw, X-, Y-, Z-axis drive mechanism for highly repeatable, point-to-point and continuous soldering of difficult or labour-intensive manual operations. 360° wettable nozzles with diameters from 3 to 20mm produce ultra-precise, miniature waves that can be programmed to a 0.5mm minimum clearance from adjacent components. The nozzle body is designed to inject preheated nitrogen for high-integrity, oxidation-free solder joints.
Also included as standard is a MicroDrop jet fluxer, a feature that is usually found on equipment in the six-figure price range. Precisely measured points or continuous streams of alcohol- or water-based flux, customised to each connection, insure proper wetting and dramatically reduce flux consumption and excess residue. The fluxer is also mounted to the X-Y drive and, like the solder pot, can reach speeds up to 400mm/s.
CAD data or scanned images of the PCB are easily imported into Windows7 software that allows simple click-and-drag programming of points or continuous paths both on- and off-line. To prevent bridging in difficult areas, angled ‘pull-off’ functions with reduction of solder flow are integrated into the software to simplify programming.
The IS-T-300 handles double-sided and mixed technology PCBs up to 300x500mm and is backed by a full two-year parts warranty and unlimited factory support. A larger model, the IS-T-460, is also available for boards up to 460x700mm.
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