The SPT200 replaces traditional spin coating equipment, providing more uniform coverage of side walls in difficult to coat applications. Ultrasonic spray has been used for photoresist deposition for years, and is a well proven method for semiconductor lithography manufacturing.
SPT200 is typically configured with Vortex or AccuMist ultrasonic spray shaping nozzles, depending upon coating requirements. Sono-Tek’s team of application engineers ensures the correct configuration for each process. At the heart of the system is Sono-Tek’s patented ultrasonic nozzle technology. All ultrasonic nozzles feature up to 95% reduction in material consumption, non-clogging performance, and precise, targeted spray patterns at ultra-low flow rates.
SPT200 unique system features include:
- Automated spray coating with recipe storage
- Designed for 100, 150, 200, and 300mm wafers
- Precision temperature control
- Integrated wafer lockdown
- Highly repeatable syringe pump with auto refill
- Manual wafer load/unload
- Highly repeatable, stable process
Sono-Tek has extensive application expertise in depositing photoresist onto MEMS and other semiconductor wafer substrates.