In addition to outstanding print transfer and response-to-pause, this no-clean solder paste also provides excellent pin-in-paste solderability and hole-fill, while remaining stable at room temperature for up to 30 days.
Indium8.9HF is perfectly suited for a variety of applications, especially automotive, due to its unique oxidation barrier technology. This solder paste delivers robust reflow capability and a wide process window, accommodating various board sizes and throughput requirements, minimizing potential defects.
