The Spider occupies only 1 m² of floor space and features linear motor drives for high accuracy: 40 µm (3σ) at full speed. Job changeover is quick with intuitive CAD import and job preparation. Mapping of heights by laser technology enables 3D applications. A mineral-cast chassis provides stability at varying temperatures. Job and quality management is integrated. An optional ISO 7 cleanroom version is available.
The Spider is capable of a variety of semiconductor packaging applications including underfill for flip chip, dam and fill chip encapsulation, glob top and cavity fill, die bonding, lid seal, thermo-compression bonding, thermal grease, 2.5/3D packaging, and copper pillar packaging.