Even heavy stains and dark rims around chips can be removed completely, leaving the copper surface in an optimal state for subsequent processes such as wire bonding or moulding.
At the same time, VIGON PE 190A has an excellent compatibility with materials commonly used in Power Electronics, such as copper, nickel and aluminum. The cleaning agent is further recommended for PCB defluxing, specifically focusing on cleanliness under low-standoff components.
VIGON PE 190A is a water based MPC cleaning agent, has no flash point and can be applied in all common spray-in-air equipment.