Component Management
HGST Reaches 10-Nanometer Patterned-Bit Milestone
HGST is leading the disk drive industry to the forefront in nanolithography, long the exclusive purview of semiconductor manufacturers, by creating and replicating minute features that will allow the doubling of hard disk drive (HDD) density in future disk drives.
Intertronics Pots the Green For Variohim
In setting up a new production project for in-house potting of temperature probes the engineers at Variohm considered a number of well-known industry standard potting compounds – and they called in the materials specialists at Intertronics.
Elite Electronic Systems Grows with Europlacer
Elite Electronic Systems has been a long-term user of Europlacer placement systems, having bought its first Progress 6 back in 1997 and following a very successful period of steady growth over the ensuing years increased to three lines of high-technology assembly equipment, including Europlacer iineo machines purchased in 2010 and 2011.
Infineon Completes 300-Millimeter Thin-Wafer Production Qualification
Infineon Technologies has achieved a major breakthrough in the manufacturing of power semiconductors on 300-millimeter thin wafers. In February, the company received the first customer go-aheads for products of the CoolMOS family produced by the 300-millimeter line at the Villach (Austria) site. The production process based on the new technology has completed qualification from start to finish and customers have given the go-ahead.
New Micro Drill from Intertronics for PCB Rework
The new CircuitMedic Micro Drill system from Intertronics is versatile and powerful – making it ideal for milling, drilling, grinding, cutting and sanding circuit boards. It removes coating, cuts circuits, cuts leads, drills holes, cuts slots, shapes FR4 and performs many other procedures using various interchangeable bits.
Going Green: Europlacer Upcycles Old Machines into New Solution
Europlacer debuts Project iico, a concept that combines outdated systems with new, innovative parts to result in an environmentally smart, technologically advanced assembly system. In the 1990s and early 2000s, Europlacer manufactured then-progressive placement systems, EP600 and Progress6.
A New Technology for Void-Free Reflow Soldering
SEHO Systems now offers a new technology for virtually void-free soldering results with the MaxiReflow HP. Whether for power electronics, electronic aviation systems, medical equipment or electronic systems for the automotive industry, voids in solder joints represent one of the main problems.
New High-Speed Pick & Place Machine From Manncorp For LED Board Production
Manncorp introduces the MC-LEDV3, a new high-speed pick and place machine built to assemble LED tube lights, flexible LED strips and LED bulb boards. The MC-LEDV3 features three pick-and-place heads mounted on a high-precision, ball-screw-driven gantry. Simultaneous pickup, on-the-fly (vision based) component alignment, and feeder placement optimization combine to achieve placement rates of up to 10,000 LEDs per hour, per IPC-9850.
Intertronics And Liquidyn Enhance High Performance Dispensing Applications
As technologies develop in industries such as electronics, energy, packaging, medical devices, cosmetics and pharmaceuticals and automotive, Intertronics have understood the need for ever more precise, reliable dispensing of micro quantities of adhesives and similar materials.
FleX Silicon-on-Polymer Available With TowerJazz Foundry CMOS
American Semiconductor announces TowerJazz is the first foundry with a CMOS process, CS18, available for physically flexible wafers and ICs utilizing FleX Silicon-on-Polymer. This announcement was made at the 12th annual Flexible & Printed Electronics Conference presented by the FlexTech Alliance held in Phoenix, Arizona on January 29 - February 1, 2013.