Ultra low power MCU cuts external component count

Forged using an advanced 40nm CMOS low-power fabrication process, this system-on-chip (SoC) employs a high level of performance and integration to help reduce external components while minimising the footprint and overall cost of the application.

The microcontroller subsystem of the SoC consists of a 96MHz Arm Cortex-M4 microcontroller with floating point unit (FPU), 512KBytes of RAM, 2MBytes of ROM (containing the stack and drivers), and 1MByte of probe-proof flash memory.

The probe-proof flash, once programmed, not only prevents hackers from reprogramming the device to gain access to sensitive user data or payment information, but also inhibits competitors from doing a flash dump to reverse engineer the firmware IP.

For additional security, the CYW20719 includes various security functions — such as ECDH, RSA, AES and SHA/MD5 hashing functions — as well as a hardware accelerator to ensure best-in-class encryption for Bluetooth.

The ultra-low-power radio in the microcontroller delivers a Bluetooth low energy (BLE) receive current (Rx) of 5.9mA with sensitivity of -95.5dBm and a transmit current (Tx) of 5.6mA at 0dBm.

Ultra-low current consumption in this device enables extended battery life for a variety of wireless IoT devices, including wearables and fitness bands, home automation, medical devices, and proximity sensors.

The CYW20719 is supported by the CYW920719Q40EVB-01 evaluation kit and the Cypress Wireless Internet Connectivity for Embedded Devices (WICED^®) Studio IoT development platform, which provides all the application programming interfaces, code snippets, and demo applications to accelerate the development process.