Half size BVM HS-771 packs a full size punch

The new HS-771 SBC from BVM is a half size (185 x 122mm) PCI card form factor unit that is ideal for embedded applications where physical space is at a premium. Despite its compact size, the SBC supports Socket P pin-out processors such as the Intel Core 2 Duo Mobile Penryn or Core 2 Extreme with a FSB up to 1066 MHz addressing up to 4GB of RAM.

The Mobile GM45 Express chipset provides excellent flexibility and performance for developers of embedded applications such as network appliances, gaming platforms and industrial automation equipment, with outstanding graphics, memory and I/O bandwidth, asset management capabilities, storage speed and reliability.

The integrated Mobile Intel Graphics Accelerator 4500MHD and Intel Clear Video Technology with graphics core speeds up to 533MHz provide enhanced graphics and 3D rendering performance and enable high-definition video playback; the unit supports numerous display types including VGA, DVI, LVDS and HDTV. The integrated audio interface is powered by the ICHM-9 chipset.

Extensive internal and external I/O capability is provided: four x 300MB/s SATA interfaces, two x Gigabit LAN ports, eight x USB 2.0 ports, one RS232 and one RS485 ports, a Mini-PCI and a PCI Express Mini card socket. System management functions include an 8-bit GPIO programmable interface and a 256-level watchdog timer.

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