Communications

Chip giving cars fast data anywhere on the planet

30th October 2023
Paige West
0

Ensilica has revealed its collaboration with VITES to provide a beamformer chip tailored for satellite user terminals. Central to VITES's new ViSAT-Ka-band terminal, this chip will facilitate the design.

This beam-forming chip by EnSilica has been refined to underpin VITES's ambition to craft efficient, cost-effective ground-based flat panel user terminals suitable for various satellite communication systems, inclusive of fixed and SatCom on the Move (SOTM) applications.

Since 2019, VITES has been specialising in broadband wireless systems for professional uses. Its terminals, driven by its unique phased array technology, have set industry standards. The latest ViSAT-Ka-band terminal is envisioned for integration into vehicles to support Communications-on-the Move applications. This ensures seamless tracking of low earth orbit (LEO) and other non-geo-synchronous (NGSO) satellites, offering users unparalleled high-speed connectivity globally, even when in transit.

The ViSAT-Ka is structured around a scalable architecture that champions powerful TDD and FDD terminals at competitive prices. Harnessing this foundation, VITES is crafting terminals suitable for terrestrial and maritime vehicles, factoring in the nuances of cost and power for automotive applications.

This innovation guarantees vehicles continual broadband access beyond the conventional 4G/5G network zones. It promises high data throughput and is designed in a compact form, suitable for both retrofitting and line integration.

Paul Morris, Vice President of the RF and communications business division at EnSilica, reflected on the journey: "In collaboration with the UK Space Agency, European Space Agency, and VITES GmbH, EnSilica has channelled its investments in this domain over the past years. Thanks to VITES's clear terminal specifications, we've honed our solution to meet market demands. This beamformer chip can complement an array of Ka- and Ku-band RFICs, including our very own EN92030, catering to diverse LEO or GEO configurations."

Martin Gassner, CEO of VITES, added: "The imminent NGSO-constellations necessitate revolutionary solutions to elevate performance whilst minimising costs and power consumption. Our ViSAT-Ka-Band terminals rise to this challenge. Collaborating with EnSilica, we're forging ahead, crafting top-tier SOTM solutions that promise broadband connectivity even in areas devoid of terrestrial networks."

Featured products

Upcoming Events

No events found.
Newsletter
Latest global electronics news
© Copyright 2024 Electronic Specifier