Communications
VIA Announces VIA AMOS-5000 Chassis Kit for Fanless Em-ITX Embedded Systems
VIA Technologies, Inc today announced the VIA AMOS-5000, a specially designed chassis kit for Em-ITX form factor boards such as the VIA EITX-3000, offering fast and easy assembly of a variety of fanless, robust IPC designs.
Rugged magnetostrictive transducers give absolute position measurement
The rugged construction of RDP Electronics Ltd’s MTS R Series analogue transducers make them well suited to a wide range of industrial applications which require a direct analogue output for continuous measurement of displacement and speed.
austriamicrosystems presents the worldwide first FlexRay transceiver produced in series, certified to the FlexRay specification V2.1 Rev B
austriamicrosystems has introduced the AS8221 FlexRay Standard Transceiver, which is certified to the latest FlexRay Standard V2.1 Rev B. This semiconductor device acts as the interface between digital logic and copper cable transmission, for the next generation of automotive networks.
GL Enhances IP Network Simulator
GL Communications Inc. announced today the release of an enhanced version of IPNetSim™ - A simple to use tool that simulates an entire IP Network in one box. Speaking to the press, Mr. Vijay Kulkarni, CEO of the company said, “IPNetSim™ simulates IP networks. Interfaces for 100 Mbps copper to 4 (Four) 1 Gbps interfaces are available. Simulate all conditions encountered in real-time such as network latency, network delay variation (jitter), ...
AIS Releases Space Saving 1U Rack Server Computers featuring Intel Core 2 Quad, Duo, and Atom Processors
American Industrial Systems Inc. (AIS), has released a compact Rack Mounted Server line featuring the latest Intel Processor. The compact industrial grade rack mounted chassis displaces only 1U (1.75” height) of space in standard server racks. System options include GM45 or 945GME chipsets equipped with Core 2 Quad/Core 2 Duo high performance processors, or low power consumption Atom N270 Series Platforms designed with a highly integrated singl...
Intel Atom Z530 processor features on OpenVPX 3U VPX-REDI board
Concurrent Technologies has introduced a leading edge ultra low power 3U VPX-REDI single board computer (SBC), the TR A40/30x RC, designed to comply with the OpenVPX VITA 65 standard. The TR A40/30x RC utilizes the 1.6 GHz Intel® Atom™ processor Z530 and the highly integrated Intel® System Controller Hub US15W both from the Intel® embedded roadmap, ensuring long term availability. The board supports up to 2 Gbytes DDR2-533 soldered SDRAM and...
High performance, OpenVPX 3U VPX-REDI board
Concurrent Technologies introduces a leading edge high performance 3U VPX-REDI single board computer based on Intel’s latest dual-core processors. The TR 501/36x is designed to comply with the OpenVPX VITA 65 standard, and utilizes the 1.86 GHz Intel Core 2 Duo SL9400 processor and the Intel® GS45 mobile class chipset both from the Intel® embedded roadmap, ensuring long term availability. The board supports up to 8 Gbytes DDR3-1066 soldered S...
Ultra Low power Intel Atom Z530 Processor PMC/XMC module
Concurrent Technologies has introduced an ultra low power processor PMC/XMC module, the XP A40/x03. The board features the 1.6 GHz Intel® Atom™ processor Z530 and the integrated Intel® System Controller Hub US15W, both chosen from the Intel® embedded roadmap to ensure long term availability of supply. Additional features include up to 2 Gbytes DDR2-533 SDRAM, 4 Gbytes of NAND Flash, graphics and a variety of I/O interfaces including a CANbus...
New Brochure for Contactless Rotary Sensors
Designer and manufacturer of high integrity position sensors, Penny + Giles, has announced a new SRH Contactless Rotary Sensors brochure. Complete with technical information, including a selection guide for ordering the various models and features, the free brochure is available in print and online. It is user-friendly and offers information about the five models in the range, from single output 28mm compact to rugged 87.5mm dual output versions ...
Extreme Engineering Solutions Now Shipping XPand1300 and XPand1200
Extreme Engineering Solutions (X-ES) is the first to ship OpenVPX compliant 3U development systems: XPand1200, a development platform for conduction-cooled modules, and XPand1300, a development platform for air-cooled modules. Both are designed to support a minimum of ten 0.8” or 1.0” pitch slots and built in accordance with OpenVPX design principles.