The high-density Cinch CIN::APSE custom connectors are the most widely implemented crimpless and solderless, high-speed interconnects in the industry and enable a quick installation.
Cinch CIN::APSE custom interconnects have been designed for board to board, IC to board, flex to board and component to board connections in high-speed digital, flex circuit and PCB applications. A wide range of profiles from 0.020” up to 1.0” and 0.5mm up to 1.0mm diameter contacts with a standard pitch of 1.0mm or greater is available. The number of contacts is not limited and the largest connector implemented to date contained 7,396 I/Os.
The patent protected design uses liquid crystal polymer insulators and bundled gold-plated molybdenum wire contacts and enables 50+ Gbps. Solderless termination is achieved through compression and the unique contact design assures multiple points of contact per I/O. Gold plated copper spacers are used for long Z-axis connectors.