Neoconix Launches Low Profile, Small Pitch, 1-Day Lead Time Connector Family

Neoconix today announced immediate availability of its new SPH1 family of compression connector products for flex-to-board and board-to-board applications. Utilizing PCBeam connector technology, these products combine high density and high reliability with outstanding electrical performance.

Within the SPH1 family of standard products, Neoconix offers area-array connectors at 0.8mm pitch, 1.0mm pitch, and 1.27mm pitch, with pin counts ranging from 80 to 120 positions. Interposer thicknesses range from 0.5mm to 3.0mm fully mated. The 0.5mm mated thickness provides one of the lowest profile flex-to-board connections in the world.

“Our business has historically revolved around custom designs, taking advantage of the unique design flexibility of PCBeam technology,” said Woody Maynard, Sr. Director of Product Marketing. “However, with our growing customer base, it is becoming increasingly important that we also have some immediately available, standardized solutions. Our goal here is to give customers some simple, off-the-shelf options that can be readily implemented with minimal design effort and up-front investment. Design adjustments can always come later if needed.”

Neoconix also offers compatible compression hardware for simple integration into the end system. The hardware includes backers, integrated alignment pins, and mounting screws. Customers have the option of ordering full kits with hardware included or ordering individual interposers only.

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