ITT releases Premier Technology brochure on key interconnection groups

27th November 2007
ES Admin
Now available from ITT is the company’s Premier Technology brochure with technical Pull Sheet and White Papers for Pogo-Pin, Break-Away, Chip-on-Flex, Stacking, Quadrax and PHD Fibre Optic interconnection products. An accompanying CD-ROM with animation files enables a visual understanding of these technologies.
Engineered for life the Cannon, VEAM and BIW products are presented in a neatly designed Pocket Folder package to store and allow details to be re-visited time after time. The White Paper technical information on the technologies includes connection details, exploded views and wiring information. Individual technologies are detailed on individual pull sheets providing functionality and technology overviews, technology summary, customer benefits and general application information. A full specification is supported by applicable international standard information and performance data.

Keith Teichmann, Director Product Management Interconnect Solutions, ITT Corporation comments: “The Pocket Folder Brochure provides a single reference point for the end user to determine which of these ITT interconnection technologies is best suited to their particular environment.” The history of connector development throughout the last century is interesting reading covering Aviation, Military, Medical, Transportation and Space from 1915 to the near future involving the current leading edge ITT interconnection technology products.

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