ITT’s 100 position MDM PCB connector provides high density signals and EMI shielding

A micro connector which can provide one hundred signals in a lightweight and compact package has been developed by leading hi-rel connector company, ITT Interconnect Solutions. The 100 position 1.27mm (0.050in) pitch MDM PCB connector allows for maximum signal density in applications where board space is restricted due to the number and size of other components. Effective EMI shielding is integrated into the connector by means of special back moulding processes, saving further space and weight on the board. Very short reach signals can be achieved as the interconnect can be terminated to flex circuitry.

Featuring ITT’s innovative twist pin contact system, the MDM connectors feature crimped and gold-plated contacts to ensure high signal integrity. Housed in an aluminum shell, this W/LCP dielectric connector series is available in multiple plating options. Jack post hardware is also available.

The combination of very high signal density, low weight and robustness suits applications such as aircraft avionics, satellite systems, electronic instrument packages and oil field exploration equipment.

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