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Hypertac connectors provide enhanced flexibility when designing wearable integrated EMI protected electronic systems

21st August 2009

Hypertac Limited

ES Admin

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Hypertac will showcase its range of harsh environment connector technologies at the DSEi exhibition being held at ExCel in London, on 8-11 September 2009. Hypertac is located at stand 890. In particular, Hypertac’s SnapTac miniature connectors will be given a high profile due to their market leading features in the field of wearable, EMI shielded, electronic systems. Now in second generation form, SnapTac connectors are based on Hypertac’s HyperSpring® contact technology which combines the company’s high reliability hyperboloid contact with the mechanical features of a spring-loaded contact to produce interconnections with improved signal integrity and proven mechanical and environmental stability over time.

The connectors are lightweight, reliable and robust to ensure that systems will not fail, even in the harshest conditions encountered in military use. Already used by the Italian military, the SnapTac connector is now being widely adopted for military projects, due to the unique IP67 sealing, combined with its data transmission speeds, design flexibility and an inherent self-cleaning wiping action for increased reliability.

Hypertac will be displaying SnapTac together with its other aerospace and defence connectors and technologies including the HBB, HDLP, miniature PCB, rack & panel, filtered and transient protected connectors in addition to fully integrated interconnect solutions. Hypertac is also presenting ‘Next generation interconnect solutions’ at the DSEi Innovation Showcase on Wednesday 9 September. Anyone attending the show is invited to attend the presentation.