Hirose expands floating BtB connector series

7th December 2023
Harry Fowle

Hirose has expanded its DF40 board-to-board floating connector series to support PCI-ex Gen.4 (16Gbps) and MIPI D-PHY Ver.1.1 (1.5Gbps).

The DF40F Series provides high-density mounting, significant space-savings, and high-temperature resistance to 125 degree for automotive applications. The DF40F Series is most commonly used in in-vehicle sensor applications including cameras, LIDAR, millimetre-wave radar, and more.

Simplifying assembly, the floating design offers a degree of play between the contacts during mating to allow the connector to absorb alignment errors. This enables multiple pairs of connectors to be used on the same PCB by absorbing the cumulative tolerances. The DF40F Series features floating contacts with a wide self-alignment range of ±0.30 mm in the X and Y directions.

The robust DF40F Series connector features a superior stamped contact design with a clear tactile click that confirms secure mating. The stamped contacts enable a longer effective mating length of 0.25 mm that provides shock and vibration resistance common to automotive applications. Further protecting signal contacts, the DF40F Series has curved contacts to prevent buckling during mating.

The DF40F Series combines a 0.4 mm pitch with a mounting depth of only 3.68 mm. Available in a 30-position version, the DF40F Series has a stacking height range of 3.5 mm to 6.0 mm.

This is a space-saving design that minimises connector depth, while ensuring a vacuum pick & place area that does not affect mountability.

“Featuring the world’s smallest width floating contact system, the DF40F Series simplifies design and assembly processes, saving OEMs time and money,” said Pete Lais, Assistant Vice President of Product Management for Hirose Electric Americas. “Ideal for in-vehicle sensor applications, the miniature DF40F Series enables customers to develop smaller end-products or add functionality to designs, all without sacrificing reliability.” 

The contact area is enclosed in a housing to protect against solder waste and flux during mounting process. Solder wicking is prevented via a nickel barrier.

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