SMT Connector Reaches New Height

The B2B High Density SMT Connector line from Advanced Interconnections Corp. is now available in a 19.05mm (.750 inch) mated height. Designed for high pin count and high density 1.27mm pitch board to board applications where durability and reliability are critical, such as servers and routers, the newest member of the B2B SMT Connector series is available in 8 and 10 row configurations from 240 to 500 positions.

The B2B SMT Connector line employs screw-machined terminals with multi-finger contacts and the company’s exclusive solder ball terminal design with outstanding coplanarity; field-proven for superior reliability and processing results. With a current rating of 3 Amps per pin, more contacts can be assigned to data/signal transfer (fewer pins are sacrificed for power/ground).

The high quality contact system, coupled with a precision molded LCP insulator, is a more rugged and durable design with extremely accurate pin true positioning, enabling it to overcome any misalignment during mating and boast significantly lower insertion & extraction forces than competitive models. With stack heights from 6mm (.236 inch) and now up to 19.05mm (.750 inch), the B2B SMT Connector line is the right choice for mezzanine board stacking applications. RoHS Compliant Sn/Ag/Cu solder ball terminals are available, along with tape & reel packaging for automated pick-and-place.

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