Thanks to a multi-holed design and increased surface area, the Honeycomb optimizes cross ventilatation, while simulatanously cooling the surrounding amibiant air. Applications include a wide range of cooling solutions for video cards, motherboards and networking applications. JARO’s adhesive mounted version eliminates the need for mounting holes in the PC Board.
Honeycomb heatsinks can be used with either plastic or metal/ceramic BGA packages, depending on thermal interface material that is used. In addition, the thin size of the Honeycomb makes it ideal for compact real estate applications. The leadtime runs 8-10 weeks ARO.