Top 5 AI products in February

Managing Editor Paige Hookway picks her top 5 AI products to be announced in February 2026.

New industrial motherboard from Kontron

Kontron introduces the K4131-Px, a powerful mITX industrial motherboard based on the new AMD Ryzen AI Embedded P100 Processor Series. Designed for demanding industrial Edge and AI applications, the board offers high computing power, excellent graphics performance, and state-of-the-art AI acceleration in a compact form factor.

Thanks to the AMD Ryzen AI Embedded P100 processors, the K4131-Px delivers exceptional graphics and AI performance and is ideal for visual data processing, machine vision, Edge AI, automation, and smart industrial systems. The integrated AI engine enables efficient inference directly at the Edge, reducing latency and minimising the need for Cloud resources.

New power module enhances AI data centre power

Microchip Technology announces the launch of the MCPF1525 Power Module, a highly integrated device with a 16V Vin buck converter that can deliver 25A per module, stackable up to 200A. The MCPF1525 enables higher power delivery within the same rack space and is combined with a programmable PMBus and I2C controls. This device is designed to power the latest generation of PCIe switches and high-performance compute MPU applications needed for AI deployments.

The MCPF1525 is packaged in an innovative vertical construction that maximises board space efficiency and can offer up to a 40% board area reduction when compared to other solutions. The compact power module is approximately 6.8 x 7.65 x 3.82mm, making it an optimal solution for space-constrained AI servers.

STMicroelectronics introduces the first automotive microcontroller with AI acceleration

STMicroelectronics announces the Stellar P3E, the first automotive microcontroller (MCU) with built-in AI acceleration for automotive Edge intelligence. Designed for future software-defined vehicles, the Stellar P3E simplifies multi-function integration for X-in-1 Electronic Control Units (ECUs) that reduce system cost, weight, and complexity.

A defining feature of the Stellar P3E is its integrated ST Neural-ART Accelerator for real-time AI efficiency – making it the first MCU with an embedded neural network accelerator for the automotive industry. Powered by this dedicated neural processing unit (NPU) with an advanced data-flow architecture for AI workloads, and combined with its rich sensing capabilities, the P3E enables smart sensing that opens the door to new applications such as virtual sensors.

Advantech expands global Edge AI partner ecosystem with DEEPX

Advantech announces its partnership with DEEPX. This collaboration expands Advantech’s AI chipset ecosystem and introduces the company’s first AI acceleration solution powered by DEEPX technology, the EAI-1961 series Edge AI Acceleration Module.

The newly launched EAI-1961 series is Advantech’s first product featuring DEEPX’s DX-M1 NPU technology. Designed in the industry-standard M.2 form factor, the module delivers up to 25 TOPS of AI inference while supporting up to 4GB of LPDDR5 memory. Its highly energy-efficient architecture ensures stable thermal behaviour even during heavy workloads, making it well suited for vision-centric applications such as robotic vision, intelligent surveillance, in-vehicle computing, and precision medical diagnostics.

Rutronik expands its Edge-AI offering

With the cExpress-R8, Rutronik introduces a high-performance COM Express R3.1 Type 6 module from ADLINK, designed for AI-driven edge computing. Powered by the AMD Ryzen Embedded 8000 Series, it delivers up to 40 TOPS AI inference performance. Combining high compute power, AI acceleration, extensive I/O connectivity and a compact form factor, the cExpress-R8 is ideal for industrial automation, medical imaging, transportation and surveillance platforms, as well as edge-oriented video and analytics solutions. ADLINK also guarantees a 10-year product lifecycle – critical for long-term system designs.

cExpress-R8 from ADLINK is a COM Express R3.1 Type 6 Compact module (95 × 95 mm) designed for demanding Edge-AI applications. It is powered by AMD Ryzen Embedded 8000 Series processors with up to eight Zen 4 CPU cores, integrated RDNA 3 GPU architecture and an XDNA NPU for AI acceleration – offering up to 40 TOPS combined CPU, GPU and NPU performance.

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