Products

RECOM adds an open frame version to range of board-mount AC/DCs.

Molex, a global electronics and connectivity innovator, has diversified its product portfolio with the introduction of the MX60 series of contactless connectivity solutions.

XP Power announces the release of a family of single output, PCB mounting AC-DC modules with power ratings from 3W to 40W that offer easy integration into BF (body floating) applications.

Codasip, the specialist in RISC-V Custom Compute, and Verilock, a US-based hardware security company, have entered into an agreement for Codasip to exclusively provide its ASIC customers with future-proof security technology from Verilock.

Knowles’ new StackiCAP MLCC capacitors offer a combination of case size, capacitance, and voltage.

Mouser Electronics and Vishay have combined to release a new eBook analysing the technologies and components supporting the next generation of Industry 4.0 solutions.

Samtec, a global pioneer in the design and manufacturer of electronic interconnect solutions, announces the opening of its newest manufacturing facility in Royersford, Pennsylvania.

Cyxtera announced the launch of its new AI + Quantum Centre of Excellence (COE) in the company’s LHR3 data centre in Reading, UK.

Synopsys has announced it is extending its collaboration with TSMC to advance multi-die system designs with a comprehensive solution supporting the latest 3Dblox 2.0 standard and TSMC’s 3DFabric technologies.

Electronics have played a key role in automotive system innovations in the past several decades. The incorporation of new semiconductor devices with novel features has enhanced the functionality offered by the vehicle’s mechanical systems. While semiconductor solutions and electronics continue to play a key role in vehicle electronics, looking ahead, innovation in vehicles will be much more characterized by innovations in and consolidation ...