Low profile package rectifiers save board space

20th July 2017
Source: Vishay
Posted By : Mick Elliott
Low profile package rectifiers save board space

Ten new 1A and 2A devices have expanded Vishay Intertechnology’s offering of surface-mount TMBS Trench MOS Barrier Schottky rectifiers in the eSMP series MicroSMP (DO-219AD) package. Providing space-saving alternatives to Schottky rectifiers in the SOD123W, the Vishay General Semiconductor devices feature reverse voltages from 45V to 150V and include 2A TMBS rectifiers in the MicroSMP that deliver forward voltage as low as 0.40V.

Currently, Schottky rectifiers with current ratings to 2A are typically available in the SOD123W and SMA packages.

The Vishay devices increase power density by offering this high forward current in the smaller MicroSMP. Measuring 2.5mm by 1.3mm with a low 0.65mm profile, the package is 35% thinner than the SOD123W while occupying 45% less board space.

For excellent thermal performance, the MicroSMP features an asymmetric leadframe design.

With their forward voltage drop down to 0.36V for 1A devices and 0.40V for 2A devices, the rectifiers reduce power loss and improve efficiency in low voltage, high frequency inverters, DC/DC converters, and freewheeling and polarity protection diodes for commercial and industrial applications.

The devices are also available in an AEC-Q101 qualified version for automotive applications.

The rectifiers feature a maximum operating junction temperature up to +175 °C and an MSL moisture sensitivity level of 1, per J-STD-020, LF maximum peak of +260 °C.

Ideal for automated placement, the devices are RoHS-compliant and halogen-free.

 

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