Patented technology takes silicon capacitors into demanding applications

25th April 2017
Posted By : Mick Elliott
Patented technology takes silicon capacitors into demanding applications

An innovative and disruptive technology is at the heart of a new range of silicon capacitors from Murata*, now available at RS Components. The patented technology from Murata Integrated Passive Solutions enables the integration of a wide range of capacitor values in silicon, allowing the range to be used in many applications that require high performance and miniaturisation.

Demanding applications targeted by the SiCap range include use in space-constrained designs, especially for ultra-broadband, as well as in RF/microwave and high-temperature applications.

The Murata SiCaps offer improved stability over temperature, voltage and aging performance, exceeding that offered by alternative capacitor technologies, making them ideal for demanding applications where stability and reliability are the main parameters.

These can include products and systems requiring extremely reliable components such as in aeronautics, avionics, and automotive markets, as well as for medical implants.

Based on a monolithic structure embedded in a mono-crystalline substrate, the high-density silicon capacitors have been developed using a metal-oxide semiconductor (MOS) process and use the third (or height) dimension to substantially increase surface area – and therefore capacitance – without increasing the device’s footprint.

The Murata SiCap range includes low-profile devices that are less than 100µm thick for decoupling inside critical-space applications such as for IC decoupling or in MOS-based sensors, broadband modules and RFID products.

There are also high-temperature types that can handle up to 250°C with high stability; ultra broadband types for signals up to 60GHz+; and high-reliability medical and automotive-grade capacitors for under the hood applications up to 200°C.

Other key features of the range include shorter interconnect for lower package parasitics, and compatibility with all packaging or assembly configurations including wire bond, bumping, laminates, leadframes and wafer-level chip-scale packaging.

*Formerly IPDiA, the company was acquired in October 2016 and became Murata Integrated Passive Solutions on 1st April 2017.


You must be logged in to comment

Write a comment

No comments




Sign up to view our publications

Sign up

Sign up to view our downloads

Sign up

Imagineering Fair at Bath & West Show
30th May 2018
United Kingdom The Royal Bath & West Society Showground, Somerset
PCIM 2018
5th June 2018
Germany Nuremberg
Developing secure and scalable IoT solutions
21st June 2018
United Kingdom Cocoon Networks, London
SENSOR+TEST 2018
26th June 2018
Germany Nürnberg Exhibition Centre
European Microwave Week 2018
23rd September 2018
Spain Ifema Feria De Madrid