With today’s high-powered semiconductors and IGBT modules, air cooling is often an inadequate method of preventing a costly thermal breakdown. For cooling high-powered electronics, IGBT modules, lasers, wind turbines, motor devices, automotive components or medical equipment, engineers are looking to liquid cooling solutions and cold plates are a preferred method for supplying localised cooling to high-powered electronics.
By transferring heat from the device to a liquid that flows to a remote heat exchanger, the heat dissipates into either the ambient or to another liquid in a secondary cooling system. ATS (Advanced Thermal Systems) new ATS-CP Series of IGBT Liquid Cold Plates provide a uniquely high thermal performance because of their mini-channel fin design. The internal, mini-channel fin structure enhances the surface area to maximise heat transfer with low pressure drop characteristics and provides uniform cold plate surface temperature.
As such, the ATS-CP series of cold plates, at a flow rate of 4 L/min, can transfer 1kW of heat between five to seven degrees Celsius temperature difference between the cold plate base and inlet fluid temperature, depending on the model. This process improves thermal performance by more than 30% as compared to commercially available cold plates.
Customisation is also available. ATS can design cold plates to meet size restrictions and manufacture cold plates to connect with a variety of components. The ATS Cold Plates are compatible with industry accepted coolants; for coolant with particles, #60 filters or finer are offered.