The Webinar covers important PCB design techniques to maximise heat transfer and minimise power delivery impedance and losses. It focuses on applying thermal models and simulation, and laying out PCBs for effective thermal management. It also discusses power/signal routing and integrity in high-density high current applications to minimise board losses and maximise performance.
- Thermal design considerations
- Power delivery network overview
- High-current routing
- Layout parasitic considerations
Register here.