Samtec, the US-based electronics components manufacturer has released a series of new connectors designed to meet the escalating bandwidth and density requirements of advanced computing systems.
The privately-held US-based group said its AcceleRate HP APM6 and APF6 connectors are aimed at applications in high-performance computing, artificial intelligence, data storage, and networking — sectors where demand for faster and more reliable data transmission has intensified.
The new 800-position connectors, which come in a low-profile 5mm stack height, are capable of supporting data rates up to 112Gbps PAM4 on a 0.635mm pitch.
The connectors are compatible with PCIe 6.0, CXL 3.2, and 100GbE protocols. They feature an open pin field array for improved grounding and routing flexibility, as well as Samtec’s Solder Column Termination technology, which the company said enhances structural integrity and solder joint reliability. A 10mm stack height version is scheduled for release in the second quarter of 2026.
“These new 800-position connectors represent a significant advancement in high-density, high-speed interconnect technology,” said Eric Mings, Product Manager for Samtec’s High-Speed Board-to-Board division. “They’re designed to meet the rigorous demands of today’s data-intensive systems while maintaining reliability.”
The APM6 and APF6 connectors are available directly from Samtec and through authorised distribution partners. The company operates more than 40 international locations and distributes its products in over 125 countries.
Samtec was founded in 1976 and supplies a range of interconnect solutions including high speed cables and optical systems.
