YINCAE, a global specialist in advanced electronic materials, is set to showcase its latest innovations in underfill, die attach, and liquid metal technologies at IMAPS, San Diego, 30th September – 1st October.
Visitors will experience solutions designed to meet the reliability, thermal, and processing challenges of today’s most demanding electronic applications.
Highlights at the IMAPS
High-performance underfill (UF 120HA2):
- 100% compatible with no-clean flux residue
- Passes 10×260°C reflow without cleaning
- Low CTE for superior reliability
- Fast flow and rapid cure for efficient assembly
Advanced die attach materials (TM 230-2):
- Low-void, high-reliability solutions
- Low-temperature process compatibility
- Options for both soldering and sintering for large-die applications
Next-generation liquid metal solutions ( TM 150LM):
- High viscosity and superior reliability
- No blow-out or pump-out, even under thermal cycling
- Exceptional heat dissipation for TIM1, TIM1.5, and TIM2 applications
“Our portfolio demonstrates a unique combination of thermal performance, reliability, and process efficiency,” said Dr. Wusheng Yin, CEO at YINCAE. “We’re excited to showcase materials that enable the future of advanced packaging and high-power devices.”
Join YINCAE at Booth #817 at the IMAPS Symposium 2025 in San Diego, CA for a live demo and to meet the team.
