“We are very excited about our relationship with Qualcomm Technologies and showcasing our new modules, which are applicable to a wide range of low- to high-end applications,” said Daniel Denzler, Senior Director, Business Line Management for Boards and Systems, Tria Technologies. “This new module family based on Dragonwing platforms enables us to address virtually any requirement, conserving power, upgrading performance, and delivering AI capabilities for use in challenging environments, across a range of module standards.”
“Dragonwing processors are designed to provide high-performance, low-power Edge Computing and on-device AI, enabling industries to achieve new heights of innovation and efficiency,” said Douglas Benitez, Senior Director, Business Development for Qualcomm Europe. “We are excited to see how Tria’s new embedded modules will empower industrial customers to push the boundaries of what is possible with AI.”
The technologies offer powerful computing, power efficiency, making them ideal for the new generation of IoT devices. The enhanced AI performance opens new markets for AI deployment at the edge.
The Tria products demonstrated in the Qualcomm Technologies area of Tria’s stand at embedded world 2025 will include:
- Tria IQ-9075 Vision AI-KIT powered by the Dragonwing IQ-9075 Processor
- Tria SMARC QCS6490 powered by the Dragonwing QCS6490 Processor
- Tria SMARC QCS5430 powered by the Dragonwing QCS5430 Processor
- Tria IQ-615 (OSM and SMARC) powered by the Dragonwing IQ-615 Processor
- Snapdragon X Elite (Com Express and Com HPC) powered by the Snapdragon X Elite Platform
One of several advantages of Tria’s new modules is that they are designed and manufactured in Germany.
Ongoing demonstrations of the new modules and more can be found on an area of Tria’s booth (Hall 3A Booth 225) dedicated to Qualcomm Technologies during embedded world from 11–13th March 2025 in Nuremberg, Germany.
