SMT Hybrid Packaging, 6-8 May 2014 in Nuremberg, Germany, offers the latest products, services and solutions in the electronic manufacturing industry, including assembly, PCB, soldering and test. Another new feature is that the exhibitors have the opportunity to present their business on the adjacent Forum.
Another highlight is the accompanying English-speaking conference, Electronic Circuits World Convention, held on 7-9 May 2014. Held every three years, this conference is organised alternately by the members associations of the World Electronic Circuits Council. With participants expected mainly from the electronics and PCB fields (predominantly in Asia), speakers from all over the world present their knowledge and research in areas such as base materials, embedded technology, surface finish, PCB quality, flexible circuits and many more.