Nordson Test & Inspection recently announced plans to present on the second day at the Heterogenous Integration Global Summit (HGIS) during SEMICON Taiwan at the TaiNex in Taipei, Taiwan from 8-12 September.
Heterogeneous Integration (HI) is revolutionising semiconductor technology, driving advancements in performance, efficiency and scalability. The theme of the second day of the Heterogeneous Integration Summit session, led by forum chairs, Dr. C.P. Hung, Vice President, ASE Inc. and Dr. Yu Po Wang, Vice President, SPIL is ‘Revolutionising Heterogeneous Integration: Pioneering Trends, Breakthrough Applications, and Future Solutions.’
Vidya Vijay, Director of Business Development at Nordson, will be presenting ‘Inspection & Metrology Technologies for Mid-End and Back-End Semiconductor that Improve Yields, Processes and Productivity.’
In the fast-paced world of semiconductor manufacturing, precision and efficiency are crucial. The semiconductor packaging industry continues to advance, with new designs adding more layers, finer features and more I/O channels for higher bandwidth and lower power consumption. Manufacturers face a growing need for high-precision inspection and measurement to detect defects and improve process control.
The presentation will focus on two optical and acoustic technologies for mid-end and back-end semiconductor inspection and metrology that improve yields, processes and productivity.
In the optical category, Vidya will highlight an industry-leading optical sensing technology, called Multiple Reflection Suppression (MRS) that eliminates reflection-based distortion from shiny and specular surfaces to enable highly accurate, high-speed inspection and metrology.
She will also share a new, revolutionary approach to automated Acoustic Micro Imaging Inspection (AMI) called SpinSAM technology. The SpinSAM AMI system delivers industry-leading throughput at 41 wafers per hour. With unparalleled sensitivity, it is the ultimate solution for accurately locating defects in a variety of wafer applications.
What distinguishes this new system is its innovative spinning scan method: it is meticulously engineered to maximise Units Per Hour (UPH), geared towards 100% inspection, without compromising accuracy. Ideal applications include bonded wafers, chip-on-wafer, stacked wafers, MEMs HBM wafers, over molded wafers and more.
