The application communicates with the board computer via SPI, whilst also being weight-optimized (compliant to aviation regulations). This example will be complimented by additional LED solutions for different application areas.
Regrading packaging solutions, HEITEC will demonstrate a modular cap rail adapter for 19” packaging which facilitates the assembly, combination and integration of electric and electronic devices of different mounting formats within one chassis. A highly available system demo for an industrial control unit will underline HEITEC’s overall competence.
DIN EN ISO 9001 certified, 13485 certified and DO178B audited, HEITEC provides the complete value chain in electronics engineering as well as systems integration, spanning from requirement analysis, systems architecture, chip design, hardware, firm- and software development, cost-optimized deployment and adaptation of standard electronic packaging technology, to verification, validation and certification.
