Heraeus to debut die top system material with live presentations at PCIM

Among the highlights at PCIM will be the debut of DTS Silver, a next-generation Die Top System material designed for high-performance applications at an optimised cost. The Heraeus Die Top System (DTS) enables copper wire on sintered power semiconductors, delivering exceptional flexibility. DTS enhances electrical and thermal conductivity, strengthens die connection reliability, and optimises overall module performance. The innovative solution DTS Silver is free of palladium and gold, offering a cost-efficient yet highly reliable alternative for power electronics manufacturers.

Heraeus Electronics will also showcase Condura.ultra, a silver-free AMB bonding technology for metal-ceramic substrates. Designed for high-end applications and with a low total cost of ownership Condura.ultra maintains outstanding reliability. Condura.ultra enables the use of thicker copper layers while allowing thinner ceramics, maintaining equal thermal resistance compared to traditional AlN substrates. With high thermal conductivity (>80W/m∙K), this innovative material is ideal for sintering, bonding, and soldering processes, offering exceptional performance.

Experts from Heraeus will deliver two insightful presentations at the e-mobility and Energy Storage Stage (Hall 6, Booth 220), providing in-depth insights into cutting-edge materials for power electronics:

• ‘Heraeus Electronics Introduces the Next Generation DTS’

Speaker: Christian Kersting

Date and time: 6^th May, 12:30pm

• ‘Ag-Free Silicon Nitride AMB Substrates for Automotive Power Module Applications’

Speaker: Oliver Mathieu

Date and time: 7^th May, 12:55pm

Heraeus Electronics will also host several live product presentations at its booth, showcasing the latest advancements in power electronics materials:

• DTS Silver – The innovative solution for cost-optimised, high-performance applications

Live Presentation: 7^th May, 14pm and 8^th May 11am

Live presentation: 6^th May 11am and 8^th May 1pm

• mAgic PE360 – Pressure silver sinter paste for module attach applications

Live presentation: 6^th May, 2pm

• Fastlane – An EU-funded project accelerating the European value chain for power electronics

Live presentation: 7^th May 7^th, 11am

Heraeus Electronics invites attendees to visit Hall 6, Booth 6-310 to experience these solutions and more firsthand and engage with technical experts.