GOEPEL to focus on process optimisation at Southern Manufacturing
On Stand E98, at the 2014 Southern Manufacturing & Electronics Exhibition, GOEPEL will demonstrate how systems for Automated Optical Inspection and Solder Paste Inspection help optimize production process, for both SMD and THT assemblies and for both offline and inline utilization.
GOEPEL will welcome visitors to learn about the multi spectral 360° operation camera system and 1°-step adjustable angled-view inspection module “Chameleon” in the company's electronics’ AOI system. Designed for any possible inspection tasks the offline and inline OptiCon AOI systems provide fast test program generation, safe fault detection at minimum cost and time efforts.
Also showcased wil be GOEPEL's 3D SPI system OptiCon SPI-Line, which the company claims is one of the fastest SPI systems on the market. Further products showcased include the system software SPI-Pilot 1.4, with optimized 3D calculation and numerous additional highlights. SPI-Pilot 1.4 features an enhanced algorithm for measured value determination, i.e. the OptiCon SPI-Line 3D System provides measurement data for volume, offset and height of solder deposit even more reliably. Additionally, the software offers an extended module for statistical process control (SPC) and further opportunities for real-time monitoring of the printing process. An easy-to-use control and well-organized display allow for the SPC module’s utilization also by a Tablet PC with touch operation. Fault and work statistics are displayed comfortably as charts and tables.
GOEPEL will also exhibit further elements, such as BERT testing, to the revolutionary strategic realignment of testing, programming, validation and emulation for the latest technology at both chip and board level. The “Embedded System Access” (ESA) technologies provide a new generation of technologies for JTAG/Boundary Scan, with chip embedded instruments, in-system programming or processor emulation tests. Technologies such as VarioTAP and ChipVORX support new dimensions in accessing components and assemblies, with Processor Assisted Programming and Test, FPGA Assisted Programming and Test and future standards like IJTAG and SJTAG.