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Essemtec wins the 2017 NPI Award for Multifunction Placement

16th February 2017
Alice Matthews

At a ceremony that took place during the IPC APEX EXPO, at San Diego Convention Centre on 14th February, Essemtec was awarded a 2017 NPI Award in the category of Component Placement – Multifunction for its FOX2. This marks the 15th industry award that the Swiss manufacturer has received in recognition of its production systems for electronic assembly and packaging.

The new FOXby Essemtec combines jetting of solder paste or glue and placement in a single machine. This version is based on the original award-winning platform, which, according to the company, is the first machine in its class with linear motors and a mineral cast frame, providing speed, stability, accuracy, and making it suited for use in small to medium production environments.

FOXhas a machine footprint of 1m2 and can accept PCB sizes up to 16x12". Components with sizes from 01005 up to 1.3x3.1" are placed. The machine achieves 7,500 cph (IPC9805A) at 50µm, 3 sigma with a two nozzle head.

Premiering in 2008, the NPI Awards programme is an annual celebration of product excellence in electronics surface mount assembly. Premier products based on the finest examples of creative advancement in technology are chosen by a distinguished panel of industry experts.

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