At embedded world 2026, on the DigiKey booth, Paige Hookway speaks with Greg Sheridan, Vice President, Strategy and Marketing and Erik Welsh Chief Technology Officer at Octavo Systems about OSD62X-PM System in Package.
Octavo Systems describes itself as “the next generation of modules,” taking the most complex elements of an embedded system — processor, DDR4 memory, power management, eMMC — and consolidating them into a single IC package. The OSD62X-PM is a prime example of this approach, integrating the Texas Instruments AM62X processor alongside DDR memory and around 40 passive components into a footprint roughly 70% smaller than a discrete equivalent. However, Welsh explains how the appeal is about more than just size; the integration enables four-layer PCB designs where engineers would typically need at least six, dramatically simplifying the layout and routing process: “DDR is a solved problem,” he notes, “but every time we do a new product, we have to go solve that problem again.” By removing that burden, Octavo allows engineering teams to focus their energy on what actually differentiates their product rather than reiterating challenges that have already been met.
That time saving has real commercial weight. Sheridan points to the potential to shave three to six months off a design cycle — a reduction that can translate to savings of $500,000 or more. Much of that gain comes from having a validated, known-good solution ready to drop onto a PCB, eliminating at least one board spin and the engineering hours that go with it. What surprises many customers, Sheridan adds, is that this integration also comes in cheaper than sourcing discrete components independently: “You’re actually going to pay more than just buying our system and package” — a result of a decade of manufacturing refinement, supply chain relationships with Texas Instruments, and memory suppliers built up over time.
The range of applications this unlocks is expanding quickly. Welsh points to robotics, wearables, AR glasses, and Edge computing as areas where the compact, ruggedised form factor opens doors that weren’t previously available. The ability to place processing intelligence closer to actuators and motors — in form factors that simply weren’t feasible before — is changing how engineers think about system architecture at the Edge.
Supporting engineers from prototype to production, Octavo has developed the 62PM BRK, an open development board measuring just 1.2″ by 4″ that provides access to all available IO, supports MikroElektronika Click-compatible add-on boards, and integrates fully with the TI SDK and Code Composer Studio toolchain. Crucially, all schematics, layouts, and design files are freely available. “You buy it, you prototype your board, and then you take that as your kind of starting point from schematics and change it around and just go from there.”
On the distribution side, Sheridan reflects that DigiKey was among the very first partners Octavo worked with — and the relationship has been central to their growth: “DigiKey is the premier supplier,” he says, highlighting the speed, availability, and scalability the partnership offers, from single units to hundreds of thousands.
Looking ahead, Octavo is working on a fully integrated power management SIP for the AM62 platform, as well as a new module built around the STMicroelectronics MP2 processor — bringing up to 4GB of DDR4 into that same compact 9 x 14mm footprint.
