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Conference highlights Asia's semiconductor industry growth

5th October 2023
Sheryl Miles
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Following the success of its inaugural edition, the second Electronics Asia Conference (EAC), a virtual conference and exhibition organised by AspenCore, the publisher of EE Times Asia, EE Times India, and EDN Asia, is set to take place from October 17 to 19, 2023.

With the theme ‘Strengthening Asia's Semiconductor Manufacturing Ecosystem,’ EAC 2023 aims to highlight the latest technology trends, innovations, and strategic insights within the electronics and semiconductor industry in Asia.

The global semiconductor industry reversed its five straight quarters of decline by registering a 3.4% revenue growth in the second quarter of 2023, according to Omdia. Driving the turnaround are the wireless segment, the automotive electronics sector, and artificial intelligence (AI), mainly due to growing demand for generative AI and data processing chips in the server space.

According to International Data Corp. (IDC), spending on AI – including software, services, and hardware for AI-centric systems – in the Asia-Pacific region is expected to reach $78.4 billion in 2027, reflecting a shift toward adopting technologies to transform operations and maintain a competitive edge in a rapidly changing market.

Meanwhile, the increasing adoption of Industry 4.0 technologies is fuelling the automation and digitalisation trends in the industrial space, thereby stimulating demand for Internet of Things (IoT) and embedded systems, as more manufacturers embrace smarter manufacturing.

These key trends are among the many developments driving Asia’s electronics and semiconductor supply chain.

EAC 2023 will put the spotlight on technology innovations that are driving the latest developments and new applications in sectors including IoT, AI/ML, embedded systems, industrial automation, smart manufacturing, the wireless sector, and the electronics and semiconductor supply chain. The event will feature a virtual fairground, an exhibition hall, and a conference space, similar to a live exhibition and conference.

Confirmed companies presenting at the virtual conference include Arm, Applied Materials, Bluetooth Special Interest Group (SIG), Cadence Design Systems, Cambridge GaN Devices, Chip 1 Exchange, GaN Systems, Infineon Technologies AG, Merck Electronics, Molex, Navitas Semiconductor, proteanTecs, NXP Semiconductors, MosChip Technologies, Mouser Electronics, Silicon Laboratories, SCHURTER Group, STMicroelectronics, Synopsys, Tektronix, and Texas Instruments.

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