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Beta LAYOUT presents 3D innovations

16th October 2014
Nat Bowers
0

 

Beta LAYOUT will exhibit solutions for automatic 3D data conversion and 3D-MID (Moulded Interconnect Device) prototyping. A comprehensive 3D package, 'brd - to - 3D' enables customers to create the complete virtual circuit board package directly from an EAGLE *.brd file.

'brd - to - 3D' provides STEP file generation, a freely rotatable 3D view in PDF format and photo-realistic images of the PCB and SMD stencil. A laser sintered 3D model of the assembled PCB can be ordered and a free 3D model is offered with PCB-POOL prototype orders, which can be used effectively for collision checking.

'3D-MID prototypes' enable ability to manufacture MID components in prototype and small batch quantities. In the production of mouldings with integrated conductive structures (MIDs), the mouldings are manufactured using injection moulding techniques. However, this method is not economically feasible for prototyping.

Visitors to the Beta LAYOUT booth will also receive information on the company's entire range, such as PCB-POOL (PCB prototype manufacture & assembly), LASER STENCIL (SMD stencils), BETA-PROTOTYPES (3D rapid prototyping) and the BETA-Estore (tools & aids for prototype PCB assembly).

In the near future, Beta LAYOUT will offer the ability to manufacture MID components in prototype and small batch quantities, including the production of mouldings by 3D printing, metallic coating and laser patterning, selective metallisation and component assembly. This technology will now be available and becomes economically viable for engineers & companies with prototype and lower quantity requirements. Start of production is planned for the second quarter of 2015. For the design of 3D MID components developers can download the free PCB-POOL edition of the layout software TARGET 3001!, which now includes extended design features.

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