Advanced profiling solutions at IPC APEX EXPO 2025

The event will highlight Solderstar’s commitment to offering advanced technologies designed to optimise soldering processes and improve product quality.

At the exhibition, Solderstar will showcase its range of profiling solutions, including the Reflow Shuttle O2. Since its launch, it has been highly successful in helping manufacturers improve reflow soldering processes by providing precise control over key parameters such as O2 ppm levels, temperature profiles, vibration and conveyor speed. This results in higher-quality solder joints, reduced defects, and enhanced process efficiency.

Keith Blakeley, Sales Manager at Solderstar, said: “Maintaining precise oxygen levels during reflow soldering is vital for ensuring strong, reliable solder joints. Our Reflow Shuttle with O2 measurement allows manufacturers to track oxygen levels in real time, enabling them to reduce defects caused by oxidation and de-wetting. With this system, manufacturers can optimise nitrogen usage, minimise waste, and enhance overall process efficiency. We are excited to demonstrate how these solutions can make a measurable impact on improving product quality and operational performance.”

Solderstar will also present the SLX thermal profiler, a highly accurate, ultra-compact, and battery-powered datalogger designed for measuring and recording process parameters in soldering processes. The SLX unit offers quick setup with minimal user input, automatically configuring itself when docked onto any SMARTLink reflow heatshield or other process accessories. With features like 2.4GHz telemetry options, and an impressive 15 hours of profiling time from just a two-hour charge, the SLX ensures high-performance, real-time data capture.

Attendees are invited to visit Solderstar at booth 1120 to find out more about its advanced profiling solutions and discuss how they can optimise their soldering processes.