Events News

With innovations and advanced technologies, electronica China 2015 and productronica China ended successfully at the Shanghai New International Expo Center, on March 19, 2015. The three-day trade fair covered 57,500 square meters of exhibition space. A total of 1,006 exhibitors from 28 countries and regions gathered to showcase their latest technologies and services. 55,365 visitors participated at this year’s show.

ROHM will present its latest power product designs at PCIM, Nuremberg, from 19th to 21st May (Hall 9, Booth 316). Demand for high performance, power, reliability, cost and energy efficiency, as well as miniaturisation, puts stress on power device design. ROHM’s novelties offer beneficial characteristics and compact packaging solutions, based on the company’s R&D activities and micro fabrication technologies.

At IMS 2015, which takes place from 17th to 22nd May in Phoenix, TMD Technologies will showcase its PTXM series of MPMs (Microwave Power Modules) as well as its PTS6900 solid state MPM. The company will also display its Ku-band Traveling Wave Tubes (TWTs) and pulsed TWT and solid state amplifiers for EMC HIRF testing.

The inaugural Cambridge Wireless Engineering and Technology Conference (CWTEC) recently set out to look at whether the wireless industry needs to integrate or differentiate and concluded that it should do both. Leading industry experts explored the future of the UK’s telecommunications infrastructure, spanning mobile, satellite, TV, IoT and wearable technology, focusing on the impact on licensed and unlicensed spectrum and the design of nex...

Over 240 speakers from more than 25 countries introduce the latest technological trends in power electronics components and systems in first publications at the PCIM Europe 2015 Conference.

Two conference sessions, two workshops and 17 German and English tutorials concerning all aspects of system integration in microelectronics make up the programme at SMT Hybrid Packaging 2015 on 5th to 7th May.

M/A-COM has announced it will collaborate with Kaiam to showcase a 400G demonstration at the Optical Fibre Conference (OFC) in Los Angeles, 24th to 26th March 2015. MACOM is consolidating the high speed semiconductor content in 100G/400G transceivers, optimising chips to provide differentiated performance, power, size and cost benefits.

A key workshop at this year's UK Device Developers' Conference will be focused on the development of safe and secure embedded system. Entitled 'developing safe and secure embedded systems using TT (Time-Triggered) architectures'. This interactive half-day session will see workshop participants involved in the development of a controller for a domestic washing machine and assisting in the design of a generic, safety-related ECU for use i...

KYZEN will showcase its new stencil cleaning products with its distributor, Envoy, in Stand L501 at FIEE Brazil, scheduled to take place 23rd to 27th March, 2015 at Anhembi in São Paulo, Brazil.

In booth #413 at OFC 2015, March 24th to 26th In Los Angeles, Altera is demonstrating two products for optical transport networks designed with Arria 10 FPGAs: the Altera SoftSilicon 400G Transponder/Muxponder (TPO516) and the Altera SoftSilicon single-chip 20-channel any-rate mapper (TPOC226) with segmentation and reassembly.